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Cutting-Edge Dicing Techniques for Advanced Materials

Universitywafer27 Nov, 2025Business

Dicing is a crucial step in semiconductor manufacturing where wafers are cut into individual dies or chips. As technology advances, the materials used in semiconductor production have become more complex, requiring innovative dicing techniques. Traditional methods that worked well for basic silicon wafers now face challenges with advanced materials like compound semiconductors, sapphire, and silicon carbide.

How To Choose The Right Silicon Wafer?

Universitywafer28 Oct, 2025Business

Selecting the appropriate silicon wafers is crucial for the success of research projects, as the wafer's specifications directly impact experimental outcomes. Here's a guide on how UniversityWafer, Inc. clients can choose the correct silicon wafers for their research, followed by a list of research applications categorized by wafer diameter, specifications, and typical volume requirements.

Semiconductor Wafers

Universitywafer04 Sep, 2025Business

UniversityWafer provides semiconductor wafers for research and industry, including silicon, SOI, sapphire, GaAs, and custom substrates. Order in small or bulk quantities with fast delivery and competitive pricing—ideal for universities, labs, and engineers worldwide.