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Guangzhou Top Leading Intelligent Technology Co., Ltd,established in 2016.Offers product lines covering semiconductors, discrete devices, communications, power device, RF, and storage, providing advanced packaging and testing total solutions.The company specializes in precision mechanical motion control, vision inspection, electronic testing, and simulation engineering, delivering semiconductor packaging and testing total solutions that support customers to achieve their target.
Die Bonding Manufacturer - Top-leading In back-end semiconductor manufacturing, the die attach process is a critical step. Top-leading’s die attach machine is based on unique and innovative concepts, offering economic benefits to customers. The Top-leading Automatic Die Bonder is a high-precision assembly system engineered for fully automated die attachment in large-scale production environments. Its modular architecture ensures outstanding process reliability, high throughput, and exceptional flexibility.
Top-Leading Intelligent Technology delivers advanced semiconductor assembly and test equipment engineered for high-precision production, repeatable yields, and full production-line integration. Our product family — including high-speed die bonders, automated optical inspection (AOI) systems, test handlers, tri-temperature handlers and precision press-fit machines — is designed for demanding markets such as advanced packaging, memory, power modules, RF/microwave and optical modules.
Semiconductor Packaging Equipment enabling precise, high-throughput chip assembly and thermal control to maximize yield, reduce footprint, and ensure package reliability in mass production. Guangzhou Top-leading Intelligent Technology Co.,Ltd was founded in 2016, offers product lines covering semiconductors, discrete devices, communications, power device, RF, and storage, providing advanced packaging and testing total solutions.
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