Global System in Package (SiP) Technology Market – Industry Analysis and Forecast (2019-2026) – by P

Maximizenetwork17 Oct, 2020News

Global System in Package (SiP) Technology Market was valued US$ XX Bn in 2018 and is expected to reach US$ XX Bn by 2026, at CAGR of XX% during forecast period. The system in package (SiP) technology market has Key driving factors are the emergence of advanced and compact consumer electronic devices and conventional packaging cost of ICs like, packaging with the variation of sizes of the ICs. The rising demand for high-performance electronic devices is creating future opportunities for the system in the packaging market. On the other hand, limited availability of resources & skills, and thermal-related issues caused by higher levels of integration are the key factors hindering the growth of the system in package (SiP) technology market.