Ling Yueyang23 May, 2025Business
Preparation phase: First, you need to prepare the designed circuit diagram and the corresponding stencil. The stencil is made according to the design of the circuit board, and has small holes corresponding to the pads on the PCB for precise control of the distribution of solder paste. Solder paste printing: The SMT printer uses a scraper to print the right amount of solder paste onto the pads of the PCB through the holes on the stencil. This process requires a high degree of precision to ensure that the solder paste is only applied to the specified location and the thickness is uniform.
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