PermiNex® 1000 & 2000 Bonding Resists for Precision Semiconductor Alignment
PermiNex® 1000 & 2000 are epoxy-based, photo-imageable bonding resists designed for applications requiring critical alignment, low-temperature processing and high bond quality. Ideal for BAW, SAW and microfluidic devices, they support precise cavity definition and reliable capping in advanced semiconductor fabrication.
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