Osisilicones27 Sep, 2024Technology
OSiTC-A36 Thermal Gap Filler is equivalent to the Tflex-HD90000 and can be adjusted according to the customer's test situation and requirements. Our liquid gap-filler materials were developed for high reliability automotive and industrial applications for harsh environments. In contrast to more traditional thermal pads, OSI liquid gap filler solutions offer distinct advantages, such as excellent thermal dissipation, vibration resistance, silicon-free chemistry to avoid possible contamination of sensitive electronic parts and high adhesion.
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