Poojasalve14 Apr, 2022Other
Chemical Mechanical Planarization (CMP) is a critical phase that occurs numerous times during the semiconductor manufacturing process. With the use of a liquid known as CMP slurry, this procedure is employed at every layer of the wafer to remove superfluous material and create a flat surface. The CMP slurry is a liquid diffusion containing microabrasive grit and active chemicals for the chemical mechanical planarization process. Furthermore, in the CMP process, CMP slurries are utilised in conjunction with CMP polishing naps and pads that are rotated and held against the wafer surface
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