Global CMP Slurry Market is expected to grow at a CAGR of 6.78% during the forecast period and is expected to reach US$ 2.34 Bn by 2030. Chemical mechanical polishing/planarization (CMP) slurries are abrasive materials, also called non-crystalline inorganic oxides, which are scattered in water blend with other chemicals and used in CMP processes for semiconductors. CMP process is employed in semiconductor manufacturing, where surfaces of wafers are leveled and smoothed with the help of abrasive slurries.
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