Based on Type, the market is sub-segmented into Flip Chip Bonder, Die Bonder. The die bonder segment

Falgunimmr10 Dec, 2024Other

Based on Type, the market is sub-segmented into Flip Chip Bonder, Die Bonder. The die bonder segment had the largest market share in 2023, the market is expected to grow at a CAGR of 3.5%. Accounting for more than three-quarters of the total market, and is expected to maintain its lead throughout the forecast period. The flip-chip bonder segment, on the other hand, is expected to grow at the fastest rate of 6.9% from 2024 to 2030