3D semiconductor packaging relies on traditional methods of interconnectivity for exhibiting superior performance at reduced power. New interconnect schemes such as copper-to-copper hybrid bonding for enabling 3D integrated circuits can be beneficial to various manufacturers. The global 3D Semiconductor Packaging Market report by Market Research Future (MRFR) looks at various approaches for packing multiple ICs and other trends and opportunities for the industry for the period of 2018 to 2023 (forecast period). The COVID-19 pandemic and its implications on manufacturing are explored in the report.